AGFB019R24C2E3E

Overview

The AGFB019R24C2E3E is an Agilex 7 F-Series System on Chip FPGA manufactured by Altera. It utilizes a 28nm process technology and features the AgF019 device density within the R24C package variant. The component integrates a Hard Processor System (HPS) alongside programmable logic fabric, supporting high-performance computing applications. It is housed in a 2340-ball FBGA package designed for surface-mount installation. The device supports moisture sensitivity levels requiring specific handling protocols during assembly.

Feature Summary

• Integrates a dual-core ARM Cortex-A53 Hard Processor System with dedicated memory controllers
• Features advanced 28nm process technology for optimized power efficiency and performance
• Supports high-speed serial transceivers for complex interconnect requirements

Applications

• High-performance networking infrastructure equipment
• Industrial automation control systems
• Medical imaging processing units

Procurement Notes

Verify the exact suffix configuration against official datasheets to ensure compatibility with required speed grades and operating temperature ranges. Confirm RoHS compliance status through manufacturer documentation prior to integration. Check for any active customer advisories or known issues lists that may impact long-term supply or design stability. Ensure proper ESD protection measures are implemented during handling due to moisture sensitivity classification.

Selection Notes

Select this model when system requirements demand integrated processor capabilities alongside reconfigurable logic resources. Evaluate pinout compatibility with existing board layouts before finalizing the choice. Consider thermal management solutions suitable for the FBGA-2340 package constraints. Validate software toolchain support for the specific Agilex 7 family architecture during the design phase.

Part Context

This component belongs to the Agilex 7 F-Series product line, representing a mid-range density option within the broader Agilex portfolio. It shares architectural similarities with other R24C package devices but offers distinct resource allocations compared to higher or lower density variants. The series emphasizes convergence of processing and programmability for edge computing tasks.

Replacement Considerations

Direct substitutes include other Agilex 7 F-Series devices with identical package footprints such as AGFD019R24C2I3E or AGFB019R24C3E4X, provided speed grades and feature sets align with design specifications. Verify pin-to-pin compatibility and electrical characteristics before substitution.