AGFB019R24C2I1VB

Overview

The Altera AGFB019R24C2I1VB is an Agilex F Series System on Chip (SoC) integrating a Field Programmable Gate Array with a quad-core ARM Cortex-A53 processor. It features 1.9 million logic elements and operates at speeds up to 1.4 GHz. The device includes 256 KB of embedded RAM and supports 480 I/Os. It utilizes a 3184-ball BGA package measuring 56x45 mm. The component functions within a junction temperature range of -40°C to 100°C and incorporates peripherals such as DMA and WDT.

Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology for embedded processing tasks.
• Provides high-density programmable logic resources suitable for complex digital design implementations.
• Supports diverse connectivity interfaces including Ethernet, USB OTG, SPI, and UART/USART.

Applications

• Industrial automation systems requiring combined control and signal processing capabilities.
• Telecommunications infrastructure utilizing high-speed serial interfaces and protocol acceleration.
• Medical imaging equipment demanding precise timing and data throughput management.

Procurement Notes

Verify the specific suffix C2 against official manufacturer documentation to confirm performance grade and temperature rating. Ensure compatibility with Agilex 7 FPGA design tools and IP libraries during the procurement phase. Confirm package dimensions and pinout assignments match the target PCB layout requirements before finalizing orders.

Selection Notes

Select this model when a balance of moderate logic density and embedded ARM processing is required. Compare against the AGFA variant if higher logic capacity or different packaging options are necessary. Evaluate power consumption profiles relative to the system's thermal constraints and cooling solutions available in the final enclosure design.

Part Context

This component belongs to the Agilex 7 F-Series family, designed for mid-range applications. It shares architectural similarities with other Agilex SoCs but offers distinct logic resource counts and package configurations. The series emphasizes integration of programmable fabric with hardened processor cores for efficient system-level solutions.

Replacement Considerations

Direct substitutes include the AGFA019R31C2I1VB and AGFB019R31C2I3V. Verify pin-to-pin compatibility and software migration paths when transitioning between these variants. Assess differences in package size and thermal characteristics to ensure mechanical fit within existing assemblies.