AGFB019R24C2I2V

Overview

The Altera AGFB019R24C2I2V is an Agilex 7 F-Series System on Chip (SoC) integrating a Field Programmable Gate Array with embedded processing capabilities. It features 1.9 million logic elements and includes a quad-core ARM Cortex-A53 MPCore processor equipped with CoreSight, ARM NEON, and floating-point units. The device operates at speeds up to 1.4GHz and provides 256KB of RAM. It utilizes a 3184-BGA package measuring 56x45 mm, supporting 480 I/Os. The component functions within a junction temperature range of -40°C to 100°C.

Feature Summary

• Integrates FPGA fabric with ARM Cortex-A53 processors for heterogeneous computing
• Supports high-speed connectivity via Ethernet, USB OTG, and SPI interfaces
• Includes DMA and Watchdog Timer peripherals for system management

Applications

• Industrial automation controllers requiring real-time processing
• Telecommunications infrastructure equipment
• Embedded systems needing combined programmable logic and application processing

Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package dimensions and thermal characteristics. Confirm that the Agilex 7 F-Series designation matches the required logic density. Ensure compatibility with Quartus Prime software versions supporting this specific device family before procurement.

Selection Notes

Select this model when both high-density programmable logic and embedded ARM processing are required in a single component. Compare the 3184-BGA footprint against board space constraints. Verify that the 1.9M logic element count meets design complexity requirements without excessive over-provisioning.

Part Context

This part belongs to the Agilex 7 F-Series, designed for mid-to-high performance applications. It shares architectural similarities with other Agilex devices but offers specific I/O counts and package options tailored for space-constrained industrial and communication systems.

Replacement Considerations

Direct replacements within the same series include AGFB019R31C2I2V or AGFB019R24C2E2V, depending on temperature grade and package variations. Cross-series migration requires re-evaluation of pinouts and logic capacity.