AGFB019R24C2I3E

Overview

The Altera AGFB019R24C2I3E is a System on Chip (SoC) device belonging to the Agilex 7 F-Series, specifically within the AGF019 logic density tier. It integrates an FPGA fabric with embedded ARM processor cores, combining programmable logic with high-performance computing capabilities. The component utilizes a 2340-pin FineLine Ball-Grid Array (FBGA) package designed for surface-mount technology applications. Key architectural features include support for advanced interconnects and memory interfaces essential for complex system designs. This SoC architecture enables hardware-software co-design, allowing developers to implement custom accelerators alongside general-purpose processing tasks within a single silicon solution.

Feature Summary

• Integrates ARM Cortex-A53 processor cores with FPGA fabric for heterogeneous computing
• Supports high-speed serial transceivers for advanced communication protocols
• Includes embedded memory blocks for data buffering and storage
• Features comprehensive I/O standards for versatile peripheral connectivity

Applications

• Telecommunications infrastructure equipment
• Industrial automation control systems
• Medical imaging devices
• Automotive infotainment and driver assistance systems

Procurement Notes

Verify the specific ordering suffix against the official datasheet to ensure correct temperature range and package variant. Confirm RoHS compliance status through manufacturer documentation prior to integration. Check for any active Process Change Notifications or Customer Advisories that may affect long-term availability or pin compatibility. Ensure supply chain sources are authorized distributors to guarantee authenticity and traceability of the component.

Selection Notes

Select this model when both high-density programmable logic and embedded processing are required in a single device. Compare logic element counts and transceiver speeds against alternative Agilex 7 variants to match performance requirements. Evaluate power consumption profiles under typical operating conditions to ensure thermal management solutions are adequate. Consider the availability of development tools and IP cores compatible with the selected device family during the design phase.

Part Context

This component is part of the Agilex 7 family, representing Intel's transition to advanced process nodes for high-performance computing. The F-Series targets cost-sensitive applications while maintaining significant performance capabilities. It succeeds previous generations by offering improved efficiency and integrated hard processor systems. The AGF019 designation indicates its position within the mid-range logic capacity spectrum of the Agilex portfolio.

Replacement Considerations

Direct replacements within the same package and pinout must be verified against the official cross-reference guide. Upgrades may require retiming analysis due to speed grade differences. Downgrades might necessitate logic optimization to fit reduced resource constraints. Always consult the latest device selection guide for confirmed compatible alternatives.