AGFB019R24C3E3E

Overview

The AGFB019R24C3E3E is a System on Chip FPGA belonging to the Intel Agilex 7 F-Series, specifically within the AGF019 device family. It integrates an ARM Cortex-A53 processor subsystem with programmable logic fabric. The component utilizes a 3184-ball BGA package measuring 56x45 mm. It supports high-speed serial transceivers and includes embedded memory resources for data processing applications.

Feature Summary

• Integrates quad-core ARM Cortex-A53 processors with NEON and floating-point units
• Combines programmable logic fabric with hardened processor subsystems
• Supports high-speed I/O standards via integrated transceiver PHYs

Applications

• High-performance networking infrastructure equipment
• Industrial automation control systems
• Medical imaging signal processing modules

Procurement Notes

Verify the specific suffix E3E against official Intel documentation to confirm pinout compatibility and thermal specifications. Ensure the design uses Quartus Prime Pro Edition software compatible with the AGF019 device family. Confirm moisture sensitivity level requirements during storage and handling procedures.

Selection Notes

Select this model when both hard processor system execution and flexible logic implementation are required in a single package. Compare the AGF019 capacity against larger AGF022 or smaller variants based on logic element needs. Evaluate the 3184-BGA footprint constraints against available PCB real estate and routing density.

Part Context

This part belongs to the Agilex 7 F-Series, which targets high-end applications requiring significant compute density. The AGF019 represents a mid-range capacity option within this series, balancing performance with power efficiency compared to higher-tier devices like the AGF022.

Replacement Considerations

Direct substitutes include other AGF019 variants such as AGFB019R24C2I3V or AGFA019R24C3E3E, provided the package and speed grade match. Verify that any replacement maintains the same BGA ball count and pin assignment for board compatibility.