AGFB019R25A2E3V

AGFB019R25A2E3V

$11,352.67
  • Description:IC FPGA AGILEX-F 2581FBGA
  • Series:Agilex F

SKU:3cfe368d0e97 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 2581FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB019R25A2E3V

Overview

The Altera AGFB019R25A2E3V is a System on Chip FPGA from the Agilex 7 F series. It integrates an ARM Cortex-A53 processor with programmable logic fabric containing approximately 1.9 million logic elements. The device utilizes a 3184-ball BGA package measuring 56x45 mm. Key specifications include a processor speed of 1.4 GHz, 256 KB of embedded RAM, and support for 480 I/O pins. It operates within a junction temperature range of -40°C to 100°C.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology and floating-point capabilities.
  • Provides a high-density FPGA fabric with approximately 1.9 million logic elements for complex digital design.
  • Supports diverse connectivity interfaces including Ethernet, USB OTG, SPI, UART, and MMC/SD/SDIO.

Applications

  • High-performance industrial automation controllers requiring deterministic processing.
  • Telecommunications infrastructure equipment utilizing integrated SoC architectures.
  • Automotive infotainment and advanced driver-assistance systems (ADAS) platforms.

Procurement Notes

Verify the specific suffix codes against the official datasheet to ensure correct package dimensions and thermal characteristics. Confirm that the ordered component matches the Agilex 7 F series designation. Check for any recent Product Change Notifications regarding labeling or material composition updates prior to finalizing procurement orders.

Selection Notes

Select this model when a combined ARM processor and high-capacity FPGA fabric are required in a single package. Ensure the design accommodates the 3184-BGA footprint and associated thermal management requirements. Verify that the available I/O count meets the interface demands of the target application without excessive external multiplexing.

Part Context

This component belongs to the Agilex 7 family, which represents Intel's advanced node technology for high-performance computing. The 'F' designation indicates the specific feature set and performance tier within the Agilex portfolio. It serves as a successor to previous generations, offering improved power efficiency and higher logic density for demanding edge and data center applications.

Replacement Considerations

Direct replacements within the same package and pinout may include other variants in the Agilex 7 F series with different logic capacities. Cross-family migration to Agilex 5 or Stratix 10 requires significant schematic and layout redesign due to architectural differences.

AGFB019R25A2E3VAGFB019R25A2E3V
$11,352.67
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