AGFB019R25A3E4X

Overview

The Altera AGFB019R25A3E4X is a System-on-Chip FPGA belonging to the Agilex 7 F-Series. It integrates an ARM-based Hard Processor System with high-density FPGA fabric and embedded memory resources within a single package. The component utilizes a 2340-ball FBGA package for surface-mount installation. This device supports advanced I/O standards and includes integrated transceivers for high-speed serial communications, enabling complex digital logic implementation alongside processor control in a unified silicon solution.

Feature Summary

• Integrates ARM-based hard processor system with programmable FPGA fabric
• Supports high-speed serial communication via embedded transceivers
• Includes embedded non-volatile configuration memory and SRAM blocks

Applications

• High-performance networking infrastructure equipment
• Industrial automation and control systems
• Test and measurement instrumentation

Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package type and temperature range. Confirm availability status as distribution channels may list restricted supply. Ensure EDA tool licenses are compatible with the Agilex 7 family before ordering.

Selection Notes

Select this model when both processing power and flexible logic density are required. Compare resource utilization against the standard F-Series variants to ensure sufficient DSP slices and memory bandwidth. Validate pin compatibility with existing board layouts if replacing previous generation components.

Part Context

This part belongs to the Agilex 7 F-Series, which represents Intel's advanced FPGA architecture. It succeeds earlier generations by offering improved performance per watt and higher I/O counts. The F-Series targets applications requiring significant data throughput and low-latency processing capabilities.

Replacement Considerations

Direct substitutes include other Agilex 7 F-Series parts with matching ball counts. Verify pin-to-pin compatibility with AGFD019R25A3E4X or similar variants. Cross-check electrical specifications and thermal requirements before implementing any alternative component.