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The AGFB019R25A3I3E is a System on Chip (SoC) Field Programmable Gate Array belonging to the Intel Agilex 7 F series. It integrates programmable logic with embedded processing capabilities, specifically featuring an ARM Cortex-A53 processor core. The device utilizes a 2581-pin FineLine Ball-Grid Array (FBGA) package designed for surface-mount technology applications. This component supports high-performance computing tasks by combining FPGA fabric flexibility with hard processor system efficiency.
Verify the specific ordering suffix against the official Intel Agilex 7 data sheet to ensure correct temperature grade and package variant. Confirm availability status through authorized distributors as supply levels fluctuate. Ensure compliance with RoHS directives and moisture sensitivity level requirements during storage and handling procedures prior to assembly.
Select this model when both substantial logic capacity and embedded ARM processing are required in a single device. Compare the 2581-pin FBGA dimensions against board space constraints. Evaluate power consumption profiles relative to the target application's thermal management capabilities and verify that the available I/O count meets interface requirements.
This component is part of the Intel Agilex 7 family, representing a transition toward hybrid silicon technology. The Agilex 7 series combines traditional FPGA architecture with embedded memory and processor subsystems. The 'F' designation indicates the specific product tier within the family, targeting high-end performance segments requiring significant computational throughput and connectivity options.
Direct replacements within the same package and pinout are limited within the Agilex 7 F series. Consider higher or lower density variants from the same family if pin compatibility allows. Legacy Stratix 10 devices may offer functional parallels but require significant redesign due to architectural differences.