AGFB019R31C2E3E

AGFB019R31C2E3E

$18,084.60
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:5e53a6506ff3 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:3184-BFBGA Exposed Pad
  • Supplier Device Package:3184-BGA (56x45)

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AGFB019R31C2E3E

Overview

The AGFB019R31C2E3E is an Agilex F Series System on Chip FPGA manufactured by Altera. It integrates a hard processor system featuring a quad-core ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point capabilities. The device provides 1.9 million logic elements and includes 256KB of embedded RAM. It operates at speeds up to 1.4GHz and supports 480 I/Os within a 3184-ball BGA package measuring 56x45mm. The component functions within a junction temperature range of 0°C to 100°C.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with CoreSight for embedded control
  • Provides 1.9 million logic elements for complex programmable logic applications
  • Supports high-speed connectivity including Ethernet, USB OTG, and PCIe interfaces

Applications

  • High-performance networking infrastructure equipment
  • Industrial automation controllers requiring real-time processing
  • Medical imaging systems demanding high data throughput

Procurement Notes

Verify the specific suffix E3E against official datasheets to confirm the commercial temperature grade and package variant. Ensure compatibility with the required PCB footprint and thermal management solutions. Confirm availability through authorized distributors as supply status may vary. Validate that the selected revision matches the intended design requirements before finalizing procurement orders.

Selection Notes

Select this model when a combination of substantial FPGA fabric and integrated ARM processing is required. Compare the 1.9M LE density against project logic utilization needs. Verify that the 3184-BGA package fits the board space constraints. Ensure the 0-100°C operating range meets the environmental conditions of the target application site.

Part Context

This component belongs to the Agilex F family, designed for mid-to-high-end applications. It shares architectural similarities with other Agilex devices but offers specific logic density and processor integration. The part number indicates a specific speed grade and package configuration within the broader Agilex portfolio.

Replacement Considerations

Direct substitutes include AGFA019R31C2E3V and AGFA019R31C2I3V, which share identical core specifications. Verify pinout compatibility and electrical characteristics before swapping. Alternative Agilex F series parts may require firmware adaptation due to minor feature differences.

AGFB019R31C2E3EAGFB019R31C2E3E
$18,084.60
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