AGFB019R31C3E3E

AGFB019R31C3E3E

$12,917.48
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:e799a7bc5deb Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:3184-BFBGA Exposed Pad
  • Supplier Device Package:3184-BGA (56x45)

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AGFB019R31C3E3E

Overview

The AGFB019R31C3E3E is an Agilex F series System on Chip (SoC) integrating a Field Programmable Gate Array with a Hard Processor System. It features 1.9 million logic elements and operates at a maximum frequency of 1.4 GHz. The processor core consists of a quad-core ARM Cortex-A53 MPCore with NEON and floating-point support, equipped with CoreSight debug infrastructure. The device includes 256 KB of RAM and provides 480 I/Os within a 3184-BGA package measuring 56x45 mm. It supports industrial temperature ranges from -40°C to 100°C TJ.

Feature Summary

  • Integrates FPGA fabric with ARM Cortex-A53 processing system for heterogeneous computing
  • Supports high-speed connectivity via Ethernet, USB OTG, and external memory interfaces
  • Includes hardware security and debugging features through ARM CoreSight technology

Applications

  • Industrial automation controllers requiring real-time processing
  • Telecommunications infrastructure equipment
  • Medical imaging systems

Procurement Notes

Verify the specific suffix E3E against official datasheets to confirm the industrial temperature grade (-40°C to 100°C). Ensure compatibility with Agilex 7 design tools and validate pinout requirements for the 3184-BGA footprint during procurement planning.

Selection Notes

Select this model when both programmable logic capacity and embedded ARM processing are required in a single component. Compare against AGFA variants if commercial temperature range suffices, or consider higher-density Agilex devices for larger logic requirements.

Part Context

This part belongs to the Agilex F family, designed for cost-sensitive applications requiring moderate performance. It shares architectural similarities with other Agilex SoCs but offers specific I/O and logic density configurations tailored for embedded control and signal processing tasks.

Replacement Considerations

Direct substitutes include other Agilex F SoCs with similar logic counts, such as AGFA019R31C3E3E, noting that the 'A' suffix typically denotes commercial temperature range while 'B' indicates industrial range. Verify package compatibility before substitution.

AGFB019R31C3E3EAGFB019R31C3E3E
$12,917.48
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