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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AGFB019R31C3E3E is an Agilex F series System on Chip (SoC) integrating a Field Programmable Gate Array with a Hard Processor System. It features 1.9 million logic elements and operates at a maximum frequency of 1.4 GHz. The processor core consists of a quad-core ARM Cortex-A53 MPCore with NEON and floating-point support, equipped with CoreSight debug infrastructure. The device includes 256 KB of RAM and provides 480 I/Os within a 3184-BGA package measuring 56x45 mm. It supports industrial temperature ranges from -40°C to 100°C TJ.
Verify the specific suffix E3E against official datasheets to confirm the industrial temperature grade (-40°C to 100°C). Ensure compatibility with Agilex 7 design tools and validate pinout requirements for the 3184-BGA footprint during procurement planning.
Select this model when both programmable logic capacity and embedded ARM processing are required in a single component. Compare against AGFA variants if commercial temperature range suffices, or consider higher-density Agilex devices for larger logic requirements.
This part belongs to the Agilex F family, designed for cost-sensitive applications requiring moderate performance. It shares architectural similarities with other Agilex SoCs but offers specific I/O and logic density configurations tailored for embedded control and signal processing tasks.
Direct substitutes include other Agilex F SoCs with similar logic counts, such as AGFA019R31C3E3E, noting that the 'A' suffix typically denotes commercial temperature range while 'B' indicates industrial range. Verify package compatibility before substitution.