AGFB019R31C3E3V

AGFB019R31C3E3V

$10,334.37
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:881b1c1c0ed8 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:3184-BFBGA Exposed Pad
  • Supplier Device Package:3184-BGA (56x45)

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AGFB019R31C3E3V

Overview

The Altera AGFB019R31C3E3V is an Agilex F Series System on Chip FPGA featuring a hard processor system with a quad-core ARM Cortex-A53 MPCore. It integrates 1.9 million logic elements and supports speeds up to 1.4 GHz. The device utilizes a 3184-ball BGA package measuring 56x45 mm, providing 480 I/Os. It includes 256 KB of RAM and peripherals such as DMA and WDT. Operating temperatures range from 0°C to 100°C TJ.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point capabilities
  • Provides 1.9 million logic elements for complex programmable logic applications
  • Supports high-speed connectivity via Ethernet, USB OTG, and SPI interfaces

Applications

  • Industrial automation controllers requiring real-time processing
  • Telecommunications infrastructure equipment
  • Medical imaging systems

Procurement Notes

Verify the specific suffix E3V against official datasheets to confirm temperature grade and package details. Ensure compatibility with Agilex 7 design tools and check for any recent PCN updates regarding labeling or material changes before finalizing procurement orders.

Selection Notes

Select this model when a balance of high logic density and embedded processing is required. Compare against the AGFA series for commercial temperature options if cost is a primary constraint. Verify that the 3184-BGA footprint fits the target PCB layout constraints.

Part Context

This component belongs to the Agilex F family, designed for mid-to-high performance applications. It sits alongside the AGFA series, differing primarily in temperature ratings and specific feature sets within the same architectural framework.

Replacement Considerations

The AGFA019R31C3E3V is a functional equivalent with a commercial temperature rating. Verify pinout compatibility and thermal requirements before substitution.

AGFB019R31C3E3VAGFB019R31C3E3V
$10,334.37
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