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The AGFB019R31C3I3E is an Agilex F series System on Chip (SoC) integrating a hard processor system with FPGA fabric. It features a quad-core ARM Cortex-A53 MPCore processor running at 1.4GHz, equipped with CoreSight debug infrastructure and NEON SIMD capabilities. The device provides approximately 1.9 million logic elements within the FPGA section. It includes 256KB of embedded RAM and supports up to 480 I/O pins. The component is housed in a 3184-ball BGA package measuring 56x45mm, designed for industrial temperature ranges from -40°C to 100°C TJ.
Verify the specific suffix C3I3E against official datasheets to confirm the package type, speed grade, and operating temperature range. Ensure compatibility with the Agilex 7 design software suite before ordering. Confirm moisture sensitivity level requirements for your manufacturing process. Check for any recent product change notices regarding labeling or packaging updates.
Select this model when a combined ARM processor and high-capacity FPGA fabric is required in a single component. Compare the 1.9M LE density against project resource utilization estimates. Verify that the 3184-BGA footprint fits the target PCB layout constraints. Consider the 1.4GHz processor speed relative to application software complexity and memory bandwidth needs.
This part belongs to the Agilex F family, which combines Intel's FPGA technology with ARM processor cores. It succeeds previous generations by offering higher performance per watt and enhanced security features. The Agilex F series targets applications needing both parallel processing flexibility and complex software execution environments.
Direct substitutes include other Agilex F devices with similar logic densities and package footprints. Cross-referencing pinouts and thermal characteristics is essential when evaluating alternative part numbers within the same family.