AGFB019R31C3I3E

AGFB019R31C3I3E

$15,500.62
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:f69650eba0c4 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:3184-BFBGA Exposed Pad
  • Supplier Device Package:3184-BGA (56x45)

Download product information

AGFB019R31C3I3E

Overview

The AGFB019R31C3I3E is an Agilex F series System on Chip (SoC) integrating a hard processor system with FPGA fabric. It features a quad-core ARM Cortex-A53 MPCore processor running at 1.4GHz, equipped with CoreSight debug infrastructure and NEON SIMD capabilities. The device provides approximately 1.9 million logic elements within the FPGA section. It includes 256KB of embedded RAM and supports up to 480 I/O pins. The component is housed in a 3184-ball BGA package measuring 56x45mm, designed for industrial temperature ranges from -40°C to 100°C TJ.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 hard processor system with NEON and floating-point support
  • Provides high-density programmable logic fabric with approximately 1.9M logic elements
  • Supports diverse peripheral interfaces including Ethernet, USB OTG, SPI, UART, and MMC/SD/SDIO
  • Includes hardware security features via ARM CoreSight debug and trace infrastructure

Applications

  • Industrial automation controllers requiring real-time processing and deterministic logic control
  • Telecommunications infrastructure equipment utilizing high-speed serial connectivity
  • Medical imaging systems demanding integrated data processing and display output capabilities
  • Automotive infotainment and instrument cluster platforms requiring robust processor integration

Procurement Notes

Verify the specific suffix C3I3E against official datasheets to confirm the package type, speed grade, and operating temperature range. Ensure compatibility with the Agilex 7 design software suite before ordering. Confirm moisture sensitivity level requirements for your manufacturing process. Check for any recent product change notices regarding labeling or packaging updates.

Selection Notes

Select this model when a combined ARM processor and high-capacity FPGA fabric is required in a single component. Compare the 1.9M LE density against project resource utilization estimates. Verify that the 3184-BGA footprint fits the target PCB layout constraints. Consider the 1.4GHz processor speed relative to application software complexity and memory bandwidth needs.

Part Context

This part belongs to the Agilex F family, which combines Intel's FPGA technology with ARM processor cores. It succeeds previous generations by offering higher performance per watt and enhanced security features. The Agilex F series targets applications needing both parallel processing flexibility and complex software execution environments.

Replacement Considerations

Direct substitutes include other Agilex F devices with similar logic densities and package footprints. Cross-referencing pinouts and thermal characteristics is essential when evaluating alternative part numbers within the same family.

AGFB019R31C3I3EAGFB019R31C3I3E
$15,500.62
Buy Now