AGFB022R24C2E3E

Overview

The AGFB022R24C2E3E is an Agilex 7 F-Series FPGA SoC manufactured by Altera. It features 2,208,000 logic elements and utilizes a 2340-pin FBGA package. The device supports SMD/SMT mounting and includes moisture sensitivity classification. It belongs to the AGILEX 7 F AGF022 series and falls under the SOC - Systems on a Chip subcategory.

Feature Summary

• Integrates FPGA fabric with embedded processor cores for system-on-chip functionality
• Supports high-speed I/O channels for complex data transmission requirements
• Enables real-time protocol adaptation and edge AI processing capabilities

Applications

• Wireline infrastructure networking equipment
• High-throughput telecommunications systems
• Edge AI inference processing units

Procurement Notes

Verify component authenticity through authorized distribution channels. Confirm RoHS compliance status and moisture sensitivity level prior to assembly. Ensure proper handling procedures are followed due to humidity sensitivity. Check for any process change notifications affecting package options or pin definitions before finalizing procurement orders.

Selection Notes

Select this model when high logic density combined with embedded processing is required. Consider the 2340-pin FBGA package constraints for PCB layout. Evaluate thermal requirements based on the specific logic utilization. Ensure compatibility with Quartus Prime design software for configuration and development workflows.

Part Context

This component belongs to the Agilex 7 F-Series family, designed for high-performance applications requiring significant programmable logic and integrated processing capabilities. It represents a generation of devices focused on wireline infrastructure and edge computing tasks, offering adaptability to evolving communication standards.

Replacement Considerations

Consult official Intel/Altera documentation for verified cross-references. Verify pinout compatibility and logic element counts against potential substitutes. Ensure package dimensions match existing board footprints. Confirm software toolchain support for any alternative part numbers.