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The AGFB022R25A2I3V is a Field Programmable Gate Array (FPGA) belonging to the Agilex 7 F-Series. It features 2,208,000 logic elements and operates within a junction temperature range of -40°C to 100°C. The device utilizes a 3184-BGA package with dimensions of 56x45 mm. This component is classified under programmable logic ICs and supports moisture sensitivity requirements.
Verify the specific suffix 'I3V' against official Intel/Altera documentation to confirm exact speed grade and commercial/industrial temperature rating. Confirm RoHS compliance status through current datasheets. Ensure ESD handling protocols are followed during assembly due to moisture sensitivity classification.
Select this model when 2.2M LE capacity is required within the Agilex 7 architecture. Compare against other Agilex 7 variants for pin compatibility and thermal performance. Validate that the 3184-ball footprint matches the target PCB design constraints and signal integrity requirements.
This part belongs to the Agilex 7 family, representing a generation of FPGAs designed for high bandwidth and power efficiency. It succeeds previous generations like Stratix 10, offering improved performance per watt for scalable system designs requiring significant programmable logic resources.
Direct substitutes include other Agilex 7 F-Series devices with compatible pinouts. Verify functional equivalence by comparing logic element counts and I/O configurations. Cross-reference with Intel's official obsolescence notices for lifecycle management.