Soc System On Chip AGFB022R25A3E3E product image

AGFB022R25A3E3E

$11,675.64
  • Description:IC FPGA AGILEX-F 2581FBGA
  • Series:Agilex F

SKU:b3951574e014 Category: Brand:

  
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AGFB022R25A3E3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2581FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFB022R25A3E3E

  • Description:IC FPGA AGILEX-F 2581FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.2M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

Soc System On Chip datasheet and documents for AGFB022R25A3E3E

AGFB022R25A3E3E

Soc System On Chip Overview

The AGFB022R25A3E3E is a Field Programmable Gate Array (FPGA) belonging to the Agilex 7 F-Series, specifically the AGF022 device variant. Manufactured by Altera, this component provides 2,208,000 logic elements for high-density programmable logic applications. It is housed in a tray package and is classified under Programmable Logic ICs within the Agilex trademark line. The device exhibits moisture sensitivity and requires appropriate handling during storage and assembly processes.

Soc System On Chip Feature Summary

  • High-capacity logic density with over two million logic elements
  • Part of the Agilex 7 F-Series architecture
  • Designed for complex system integration requirements

Soc System On Chip Applications

  • High-performance digital signal processing systems
  • Complex programmable logic controller implementations
  • Advanced telecommunications infrastructure hardware

Soc System On Chip Procurement Notes

Verify part authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status via official documentation before procurement. Ensure proper moisture barrier packaging is maintained until soldering to prevent damage due to humidity sensitivity during surface mount assembly.

Soc System On Chip Selection Notes

Select this model when specific Agilex 7 F-Series performance characteristics are required. Compare logic element counts against alternative devices if lower density suffices. Verify package compatibility with existing PCB footprints and ensure thermal management solutions align with the device's operational power envelope.

Soc System On Chip Part Context

This component is part of the broader Agilex 7 family, which includes variants like AGFA022R24C3E3E and AGFA022R25A2E3E. These devices share architectural similarities but differ in specific suffixes indicating package or speed grades. The AGF022 designation identifies the specific silicon size within the series.

Soc System On Chip Replacement Considerations

Direct substitutes within the same family include AGFA022R25A2E3E and AGFA022R24C3E3E. Verify pinout and electrical specifications match exactly before substitution. Cross-reference datasheets to ensure functional equivalence in the target application environment.

AGFB022R25A3E3EAGFB022R25A3E3E
$11,675.64
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