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AGFB022R31C2E1VB is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 3184BGA. Review the specifications below when checking this part for your BOM.
The AGFB022R31C2E1VB is a System-on-Chip FPGA from the Intel Agilex 7 F-Series, manufactured by Altera. It integrates 2.2 million logic elements within a 3184-ball BGA package measuring 56x45 mm. The device features a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology, operating at speeds up to 1.4 GHz. It includes 256 KB of embedded RAM and supports 720 I/O pins. Connectivity options encompass Ethernet, USB OTG, SPI, UART, I2C, and MMC/SD interfaces. The component operates within a junction temperature range of 0°C to 100°C and is classified as moisture-sensitive.
Verify the specific suffix codes against official datasheets to confirm package dimensions and thermal characteristics. Confirm moisture sensitivity level requirements prior to assembly. Ensure compatibility with the Agilex 7 design ecosystem tools. Check for any recent product change notifications regarding labeling or material composition updates before finalizing procurement specifications.
Select this model when a balance of moderate logic density and integrated ARM processing is required. Compare against the Agilex I series if higher performance or different memory configurations are needed. Evaluate the 3184-ball package constraints against PCB layout limitations. Consider the 1.4 GHz processor speed relative to application software complexity and real-time processing demands.
This component belongs to the Agilex 7 F-Series, which targets cost-sensitive applications compared to the H-Series. It shares the same physical package and pinout structure as other R31 devices in the family, allowing for potential form-factor compatibility within the same series. The F-Series emphasizes efficient resource utilization for embedded control and connectivity tasks.
Direct substitutes include other Agilex 7 F-Series devices with identical R31 packaging, such as AGFB022R31 variants with different suffixes indicating minor manufacturing revisions. Cross-family replacements like Agilex I models require significant schematic and firmware redesign due to architectural differences.
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