AGFB022R31C2E2VB

Overview

The AGFB022R31C2E2VB is a System on Chip FPGA from the Agilex 7 F-Series, manufactured by Altera. It integrates 2,208,000 logic elements within a 3184-ball FBGA package measuring 56x45 mm. The device features an embedded quad-core ARM Cortex-A53 MPCore processor with CoreSight, NEON, and floating-point capabilities. Operating specifications include a maximum processor speed of 1.4 GHz and 256 KB of embedded RAM. It supports 720 I/Os and includes peripherals such as DMA and WDT. The component operates within a junction temperature range of 0°C to 100°C and is moisture sensitive.

Feature Summary

• Integrates high-density programmable logic with embedded ARM processing cores for heterogeneous computing.
• Supports diverse connectivity interfaces including Ethernet, USB OTG, SPI, UART, and MMC/SD/SDIO.
• Features bare pad packaging for enhanced thermal performance and mechanical stability.

Applications

• High-performance network infrastructure equipment
• Industrial automation controllers requiring real-time processing
• Edge computing nodes integrating FPGA flexibility with CPU control

Procurement Notes

Verify the specific suffix 'E2' against official Altera documentation to confirm electrical characteristics and temperature ratings. Confirm RoHS compliance status through the manufacturer's current datasheet. Ensure ESD handling protocols are followed due to moisture sensitivity classification. Validate pinout compatibility during board design review.

Selection Notes

Select this model when system requirements demand both substantial FPGA fabric resources and integrated application processing. Compare against Agilex I-series variants if different temperature ranges or core configurations are needed. Evaluate power consumption profiles against available cooling solutions given the BGA form factor.

Part Context

This part belongs to the Agilex 7 F-Series, designed for applications balancing high throughput with embedded control. It sits alongside other R31 package devices in the 022 logic density tier. The series emphasizes integration of programmable logic with hardened processor subsystems.

Replacement Considerations

Direct substitutes include AGIB022R31A1E2VB and AGIB022R31A2E2VB, which share the same package and logic density but differ in series designation (I-Series vs F-Series). Verify functional equivalence regarding processor integration and interface support before substitution.