AGFB022R31C2I3V

AGFB022R31C2I3V

$22,882.90
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:8827760922d8 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.2M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

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AGFB022R31C2I3V

Overview

The AGFB022R31C2I3V is an Agilex F-Series System-on-Chip FPGA manufactured by Intel (formerly Altera). It integrates a four-core ARM Cortex-A53 processor with CoreSight debug support and floating-point capabilities. The device features approximately 2.2 million logic elements and includes 256KB of embedded RAM. It operates at a maximum frequency of 1.4GHz and supports up to 720 I/O pins. The component is housed in a 3184-ball BGA package measuring 56x45mm. It is rated for industrial temperature ranges from -40°C to 100°C junction temperature.

Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point units
  • Provides high-density programmable logic fabric with over two million logic elements
  • Supports diverse connectivity interfaces including Ethernet, USB OTG, SPI, and UART
  • Includes hardware debugging infrastructure via ARM CoreSight technology

Applications

  • Industrial automation controllers requiring real-time processing
  • Telecommunications infrastructure equipment
  • Automotive infotainment and gateway systems
  • Medical imaging devices

Procurement Notes

Verify the specific suffix codes against official datasheets to confirm temperature range and package variations. Ensure compatibility with Intel Quartus Prime software versions supporting the Agilex family. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly planning.

Selection Notes

Select this model when both high-performance computing and flexible logic are required. Compare against other Agilex series members based on logic density and processor core counts. Verify that the 3184-ball package fits the target PCB footprint and thermal constraints.

Part Context

This part belongs to the Agilex F-Series, designed for cost-sensitive applications within the broader Agilex portfolio. It shares architectural similarities with higher-end Agilex models but offers optimized resource allocation for mid-range performance requirements.

Replacement Considerations

Direct replacements include other Agilex I or F-series variants with matching pinouts. Cross-family migration to Stratix or Cyclone devices requires significant redesign due to architectural differences.

AGFB022R31C2I3VAGFB022R31C2I3V
$22,882.90
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