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The AGFB022R31C2I3V is an Agilex F-Series System-on-Chip FPGA manufactured by Intel (formerly Altera). It integrates a four-core ARM Cortex-A53 processor with CoreSight debug support and floating-point capabilities. The device features approximately 2.2 million logic elements and includes 256KB of embedded RAM. It operates at a maximum frequency of 1.4GHz and supports up to 720 I/O pins. The component is housed in a 3184-ball BGA package measuring 56x45mm. It is rated for industrial temperature ranges from -40°C to 100°C junction temperature.
Verify the specific suffix codes against official datasheets to confirm temperature range and package variations. Ensure compatibility with Intel Quartus Prime software versions supporting the Agilex family. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly planning.
Select this model when both high-performance computing and flexible logic are required. Compare against other Agilex series members based on logic density and processor core counts. Verify that the 3184-ball package fits the target PCB footprint and thermal constraints.
This part belongs to the Agilex F-Series, designed for cost-sensitive applications within the broader Agilex portfolio. It shares architectural similarities with higher-end Agilex models but offers optimized resource allocation for mid-range performance requirements.
Direct replacements include other Agilex I or F-series variants with matching pinouts. Cross-family migration to Stratix or Cyclone devices requires significant redesign due to architectural differences.