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The Altera AGFB023R24C2E3E is an Intel Agilex 7 F-Series FPGA SoC device housed in a 2340-ball FBGA package. It belongs to the mid-range capacity tier within the Agilex 7 family, designed for high-performance system-on-chip applications requiring integrated programmable logic and embedded processing capabilities. The component supports surface-mount installation and is classified as moisture-sensitive. Official documentation confirms its designation as a System on a Chip (SoC) variant, distinguishing it from pure FPGA counterparts by integrating hard processor systems alongside the fabric.
Verify the specific ordering suffix E3E against the official Intel Agilex 7 product selection guide to confirm temperature grade and packaging specifications. Ensure that the procurement channel provides valid traceability documentation. Confirm RoHS compliance status through the manufacturer's current declaration, as regulatory requirements may vary by region and production batch date.
Select this model when design requirements exceed the capacity of lower-tier Agilex 7 devices but do not necessitate the highest-end resources. Evaluate memory controller availability and transceiver lane counts against interface specifications. Compare resource utilization estimates against the AGFA023 and AGFD023 variants to ensure optimal cost-to-performance balance for the target application workload.
This component is part of the Intel Agilex 7 F-Series, which represents the company's latest generation of adaptive SoC technology. The series integrates ARM Cortex-A53 processors with high-density FPGA fabric. The AGFB023 designation indicates a specific logic capacity level within the family, positioned between smaller AGFA/AGFB019 devices and larger AGFC/AGFD023 variants.
Direct functional substitutes include other Agilex 7 F-Series devices with compatible pinouts and higher or equal logic capacities, such as AGFB027R24C2E3E. Cross-family replacements require significant redesign due to architectural differences. Verify pin compatibility and thermal characteristics before considering alternative packages.