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The AGFB023R24C2E3V is an Intel Agilex 7 F-Series System on Chip FPGA. It utilizes a 10nm process technology and features an integrated ARM Cortex-A53 processor core alongside programmable logic fabric. The device is housed in a 2581-ball FBGA package designed for surface-mount installation. Official documentation confirms its classification within the Agilex 7 family, supporting high-performance computing and complex system integration tasks through its hybrid architecture.
Verify component authenticity by cross-referencing the manufacturer's part number against official datasheets. Confirm package type and temperature grade match design requirements. Check for moisture sensitivity labels and handling instructions prior to assembly. Ensure supply chain sources provide valid traceability documentation.
Select this model for designs requiring combined processing and logic capabilities. Evaluate memory requirements based on the specific Agilex 7 F-Series configuration. Consider thermal management solutions suitable for the FBGA-2581 package. Verify software tool compatibility with the Quartus Prime Pro Edition for optimal development flow.
This component belongs to the Intel Agilex 7 F-Series, representing a generation of SoC FPGAs targeting high-end communications and industrial applications. It succeeds previous generations by offering improved power efficiency and higher logic density. The series supports diverse connectivity options essential for modern data center and edge computing architectures.
Direct substitutes include other Agilex 7 F-Series variants such as AGFA023 or AGFC023, depending on specific logic and memory needs. Cross-family replacements like Stratix 10 may require significant redesign. Always verify pinout compatibility and software migration paths before swapping components.