AGFB023R25A2E4F

Soc System On Chip Overview

The AGFB023R25A2E4F is a System on Chip FPGA belonging to the Agilex 7 F-Series family, manufactured by Altera. It utilizes an FBGA-2581 package for surface mount installation and is classified as a humidity-sensitive device. The component integrates programmable logic fabric with embedded processing capabilities, designed for high-performance computing and connectivity applications requiring scalable architecture.

Soc System On Chip Feature Summary

• Integrates Agilex 7 spatial architecture for efficient compute and memory scaling
• Supports high-speed I/O channels for demanding network infrastructure
• Enables real-time data handling and protocol adaptability

Soc System On Chip Applications

• Wireline telecommunications infrastructure
• High-throughput data transmission systems
• Edge AI inference processing

Soc System On Chip Procurement Notes

Verify part authenticity through authorized distribution channels. Confirm RoHS compliance status via official documentation. Ensure proper moisture barrier packaging handling due to sensitivity classification. Validate pinout compatibility with target PCB layout before integration.

Soc System On Chip Selection Notes

Select this model for designs requiring Agilex 7 F-Series scalability. Consider the FBGA-2581 package constraints for board space. Evaluate thermal requirements against the specific operating environment. Ensure design tools support the Agilex 7 architecture for programming.

Soc System On Chip Part Context

This component is part of the Agilex 7 product line, representing Altera's advanced FPGA technology. It builds upon previous generations with enhanced performance metrics and extended lifecycle support. The F-Series designation indicates specific feature sets optimized for high-end applications.

Soc System On Chip Replacement Considerations

Check for direct cross-references within the Agilex 7 family. Verify functional equivalence if substituting with other F-Series variants. Ensure software toolchain compatibility remains consistent across potential replacements.