AGFB023R31C2E4X

Soc System On Chip Overview

The Altera AGFB023R31C2E4X is an Agilex F Series System-on-Chip FPGA featuring a hard processor system with a quad-core ARM Cortex-A53 MPCore. It integrates 2.3 million logic elements within a 3184-ball BGA package measuring 56x45 mm. The device operates at speeds up to 1.4 GHz and includes 256 KB of RAM. It supports I/O counts of 480 and functions within a junction temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point capabilities
• Provides 2.3 million logic elements for complex programmable logic applications
• Supports high-speed connectivity via Ethernet, USB OTG, and SPI interfaces

Soc System On Chip Applications

• Industrial automation controllers requiring embedded processing
• Network infrastructure equipment utilizing Ethernet connectivity
• Medical imaging systems demanding high-performance logic fabric

Soc System On Chip Procurement Notes

Verify the specific suffix C2E4X against official datasheets to confirm package dimensions and thermal characteristics. Ensure compatibility with Agilex 7 design tools before procurement. Confirm that the supplier provides genuine Altera components with traceable documentation.

Soc System On Chip Selection Notes

Select this model when a combination of ARM processing power and substantial FPGA fabric is required. Compare logic density and I/O availability against other Agilex F series variants. Evaluate power consumption profiles relative to the 1.4 GHz operating speed for thermal management planning.

Soc System On Chip Part Context

This component belongs to the Agilex F family, designed for high-performance computing and industrial applications. It combines the flexibility of FPGA technology with the efficiency of an embedded ARM processor core, enabling heterogeneous computing architectures in a single chip solution.

Soc System On Chip Replacement Considerations

Consult official migration guides for Agilex family transitions. Verify pin-to-pin compatibility with existing designs if substituting similar density parts. Review known issues lists for both source and target devices.