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AGFB023R31C2I1VB is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 3184BGA. Review the specifications below when checking this part for your BOM.
The Altera AGFB023R31C2I1VB is an Agilex F Series System on Chip (SoC) integrating a Field Programmable Gate Array with embedded processing capabilities. It features approximately 2.3 million logic elements and includes a quad-core ARM Cortex-A53 processor cluster equipped with CoreSight debug infrastructure, NEON multimedia extensions, and floating-point units. The device operates at speeds up to 1.4 GHz and contains 256 KB of embedded RAM. It utilizes a 3184-pin BGA package measuring 56x45 mm, supporting 480 I/Os. The component functions within a junction temperature range of -40°C to 100°C.
Verify the specific suffix codes against official datasheets to confirm package dimensions and thermal characteristics. Ensure compatibility with the required voltage levels for the embedded memory and I/O standards. Confirm that the design supports the necessary pin count and ball grid array configuration for the target PCB layout.
Select this model when both substantial logic capacity and embedded application processing are required in a single device. Compare against pure FPGA options if processing power needs exceed the capabilities of the integrated ARM cores. Evaluate thermal management requirements given the high pin count and operating frequency specifications.
This component belongs to the Intel Agilex 7 F-Series family, designed for mid-to-high-end applications balancing performance and power efficiency. It succeeds previous generations by offering improved transceiver speeds and enhanced security features while maintaining software compatibility with existing Agilex development tools and IP libraries.
Direct replacements within the same series include AGFA023R31C2I1VB and AGFC023R31C2I1VB. Verify pinout compatibility and electrical specifications before substitution. Consult official change notifications for any package or marking updates affecting mechanical fit.
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