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AGFB027R24C2E1VR2 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340FBGA. Review the specifications below when checking this part for your BOM.
The AGFB027R24C2E1VR2 is an Intel Agilex F-Series System on Chip FPGA featuring a quad-core ARM Cortex-A53 processor. It integrates approximately 2.7 million logic elements within a 2340-ball BGA package. The device supports high-speed interfaces including Ethernet, USB OTG, and PCIe. Operating temperatures range from -40°C to +100°C junction temperature. It includes 256KB of embedded RAM and supports CoreSight debugging. The component utilizes the R24C package variant.
Verify the specific engineering sample status associated with the R2 suffix before procurement. Confirm that the required Quartus Prime Pro license version matches the hardware revision. Ensure compatibility with existing board layouts regarding the 2340-ball BGA footprint and thermal requirements.
Select this model when both high-end FPGA fabric capacity and embedded ARM processing are required in a single die. Compare against standard FPGA variants if software execution is not needed. Verify that the industrial temperature rating meets the environmental constraints of the target deployment scenario.
This component belongs to the Intel Agilex 7 F-Series family, designed for applications demanding high bandwidth and low latency. It represents a convergence of FPGA flexibility and processor efficiency. The R24C designation indicates a specific package configuration within the broader Agilex portfolio.
Direct substitutes include other Agilex F-Series devices with similar logic counts and package types. Evaluate AGFA027R24C2E1V or AGFB027R24C2I1V for functional equivalence. Check datasheets for pin-to-pin compatibility and electrical parameter alignment.
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