AGFB027R24C2E2VR2

Soc System On Chip Overview

The Altera AGFB027R24C2E2VR2 is a Field Programmable Gate Array (FPGA) belonging to the Agilex F-Series, specifically the AGF027 device variant. It features an embedded ARM Cortex-A53 processor core operating at 1.4GHz and provides approximately 2.7 million logic elements for programmable logic implementation. The component utilizes a 2340-ball FineLine BGA package with a 0.8mm pitch. Key specifications include a maximum operating temperature of +35°C and a minimum operating temperature of 0°C. This specific part number serves as the evaluation target for the DK-DEV-AGF027F1ES development kit.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point capabilities
• Provides high-density programmable logic resources within the Agilex F-Series architecture
• Supports system-on-chip integration through combined FPGA and microprocessor fabric

Soc System On Chip Applications

• Evaluation and prototyping using the Intel Agilex F-Series FPGA Development Kit
• System-on-Chip (SoC) design verification for embedded processing applications
• Development of complex digital logic designs requiring integrated ARM processing cores

Soc System On Chip Procurement Notes

Verify the exact suffix configuration against official datasheets before procurement, as alphanumeric codes define package type, speed grade, and industrial/commercial temperature ranges. Confirm availability status directly with authorized distributors, as this specific engineering sample or evaluation unit may have limited distribution channels compared to standard production parts.

Soc System On Chip Selection Notes

Select this component when utilizing the Agilex F-Series family for mixed-signal and processing-intensive applications. Ensure the design environment supports the Quartus Prime Pro software suite required for programming the embedded ARM cores and configuring the FPGA fabric. Verify that the thermal management solution accommodates the specific operating temperature range defined by the C2E2 suffix.

Soc System On Chip Part Context

This device is part of the Agilex 7 F-Series portfolio, designed to bridge high-performance computing and flexible logic. It shares architectural similarities with other AGFA and AGFB variants in the 027 density class but differs in package options and speed grades. The R24 designation indicates the specific ball grid array footprint used for board layout.

Soc System On Chip Replacement Considerations

Direct functional replacements within the same package and pinout are limited due to specific speed and temperature grading differences. Consider the AGFA027R24C2E2VB or AGFA027R24C2I2V for similar logic density and ARM core integration, though package and environmental ratings must be verified against the original design requirements.