AGFB027R24C2I1V

Soc System On Chip Overview

The AGFB027R24C2I1V is a System on Chip (SoC) device within the Agilex F series, manufactured by Altera. It integrates a Field Programmable Gate Array with 2.7 million logic elements and a quad-core ARM Cortex-A53 MPCore processor running at 1.4 GHz. The component features 256 KB of RAM and supports 744 I/Os. It operates within a temperature range of -40°C to 100°C TJ and utilizes a 2340-BGA package.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology and floating-point support
• Provides 2.7 million logic elements for programmable logic implementation
• Supports diverse connectivity including Ethernet, USB OTG, SPI, UART/USART, and MMC/SD/SDIO

Soc System On Chip Applications

• Embedded systems requiring combined processing and programmable logic capabilities
• Industrial automation controllers utilizing ARM cores and FPGA acceleration
• Communication infrastructure equipment supporting high-speed serial interfaces

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package type and speed grade. Confirm moisture sensitivity level requirements during storage and handling. Ensure compatibility with Quartus Prime software versions for the Agilex F family before ordering.

Soc System On Chip Selection Notes

Select this model when 2.7M LE capacity and quad-core ARM processing are required in a compact BGA footprint. Compare against AGFA027R24C2I1V if different packaging options are needed. Evaluate thermal performance constraints given the 100°C TJ operating limit.

Soc System On Chip Part Context

This part belongs to the Agilex F series, designed for mid-range SoC applications. It shares architectural similarities with other Agilex devices but offers specific logic density and processor integration distinct from the Agilex M or I series.

Soc System On Chip Replacement Considerations

AGFA027R24C2I1V is a related variant within the same logic density class. Verify pinout and package differences before substitution.