AGFB027R24C3I3V

Soc System On Chip Overview

The AGFB027R24C3I3V is a System-on-Chip FPGA from the Intel Agilex 7 F series. It integrates a quad-core ARM Cortex-A53 processor with CoreSight debug support and floating-point capabilities alongside 2.7 million logic elements. The device operates at speeds up to 1.4 GHz and features 744 I/Os within a 2340-ball FBGA package. It includes 256KB of RAM, DMA controllers, and watchdog timers. Connectivity options encompass Ethernet, USB OTG, SPI, UART, and MMC/SD interfaces. Operating temperatures range from -40°C to 100°C TJ.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with NEON and floating-point units for embedded control tasks.
• Provides 2.7 million logic elements for high-density programmable logic implementation.
• Supports diverse peripheral interfaces including Ethernet, USB OTG, and standard serial protocols.

Soc System On Chip Applications

• Wireless infrastructure equipment such as O-RAN Radio Units
• Macro and micro base station processing
• Virtualized RAN (vRAN) and fronthaul applications

Soc System On Chip Procurement Notes

Verify the specific suffix 'I3' against official Intel documentation to confirm temperature grade and package variant accuracy. Confirm RoHS compliance status and moisture sensitivity level prior to procurement. Ensure design files match the exact part number to avoid compatibility issues with Agilex 7 development tools.

Soc System On Chip Selection Notes

Select this model when requiring integrated ARM processing with high-capacity FPGA fabric in a compact BGA form factor. Compare logic density and I/O counts against other Agilex 7 variants if system requirements exceed 2.7M elements. Verify power supply requirements and thermal management needs for the 2340-ball package configuration.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F family, designed for high-performance computing and communications. It succeeds previous generations like Stratix 10 by offering improved performance-per-watt. The Agilex 7 platform supports advanced packaging technologies and integrates hard processor systems for converged SoC designs.

Soc System On Chip Replacement Considerations

Consult Intel's official cross-reference guides for verified substitutes. Alternative Agilex 7 models may offer different logic densities or I/O configurations. Ensure any replacement maintains pinout compatibility or requires board redesign.