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AGFB027R25A2I3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2581FBGA. Review the specifications below when checking this part for your BOM.
The AGFB027R25A2I3E is a System on Chip FPGA belonging to the Agilex 7 F-Series. It integrates a quad-core ARM Cortex-A53 processor with an FPGA fabric containing 2.7 million logic elements. The device operates at a maximum processor frequency of 1.4 GHz and includes 256 KB of embedded RAM. It features 624 I/O pins and supports interfaces including Ethernet, USB OTG, SPI, UART, and MMC/SD. The component is housed in a 2581-ball FBGA package, rated for commercial temperature ranges from -40°C to 100°C TJ, and exhibits moisture sensitivity level 3.
Verify the specific suffix 'E' against official Altera documentation to confirm its exact meaning regarding packaging or revision status. Confirm availability through authorized distributors as supply may be restricted. Ensure compliance with RoHS directives and check for any recent Product Change Notices affecting labeling or materials before procurement.
Select this model when a combination of significant FPGA logic capacity and embedded ARM processing is required. Compare the 2.7M LE count against project requirements to ensure sufficient resource headroom. Evaluate the 2581-ball FBGA package constraints for PCB layout complexity and thermal management needs relative to alternative Agilex 7 variants.
This component is part of the Agilex 7 F-Series, designed for applications demanding high performance and low power consumption. It sits within the broader Altera portfolio, succeeding previous generations like Stratix 10. The series emphasizes advanced process technology and integrated hard IP blocks to accelerate time-to-market for complex electronic designs.
Consult official substitution guides for compatible Agilex 7 devices. Verify pinout compatibility if replacing with other FBGA packages. Check for functional equivalence in ARM core specifications and FPGA logic density before implementing any cross-model substitutions.
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