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AGFB027R31C2E1VB is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 3184BGA. Review the specifications below when checking this part for your BOM.
The AGFB027R31C2E1VB is an Agilex F-series System on Chip (SoC) integrating a hard processor system with FPGA fabric. It features a quad-core ARM Cortex-A53 MPCore processor running at 1.4GHz, equipped with CoreSight debug infrastructure and NEON SIMD capabilities. The device provides 2.7 million logic elements within the programmable fabric. It includes 256KB of embedded RAM and supports up to 744 I/O pins. The component operates in commercial temperature ranges from 0°C to 100°C junction temperature.
Verify the specific suffix codes against official datasheets to confirm package dimensions and thermal characteristics. Ensure compatibility with the intended operating temperature range before finalizing orders. Confirm moisture sensitivity level requirements for surface mount assembly processes. Validate pinout assignments against reference designs to prevent hardware integration errors during prototyping phases.
Compare this model against other Agilex F-series variants based on required logic density and I/O count constraints. Evaluate the hard processor system performance needs against the integrated ARM Cortex-A53 specifications. Consider thermal management solutions suitable for the BGA package form factor. Review available IP cores and software support tools for development environment compatibility.
This component belongs to the Altera Agilex 7 F-Series family, designed for high-performance embedded applications. It combines the flexibility of FPGA fabric with the efficiency of a hardened ARM processor core. The series targets markets requiring low latency and high bandwidth processing capabilities within a single silicon die solution.
Direct substitutes include AGFA027R31C2E1VB and AGFA027R31C2E2VB within the same Agilex F-series lineup. Cross-family replacements require careful evaluation of pinout compatibility and feature set differences. Verify that alternative devices meet or exceed the original logic element count and processor speed requirements.
The specified operating temperature range extends up to 100°C junction temperature.
Yes, the integrated ARM Cortex-A53 cores are equipped with CoreSight debug infrastructure.
The device supports up to 744 I/O pins depending on the specific configuration and package options.
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