Soc System On Chip AGFB027R31C2I1V product image

AGFB027R31C2I1V

$35,682.39
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:c9f09d4e2acc Category: Brand:

  
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AGFB027R31C2I1V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 3184FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFB027R31C2I1V

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.7M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

Soc System On Chip datasheet and documents for AGFB027R31C2I1V

AGFB027R31C2I1V

Soc System On Chip Overview

The AGFB027R31C2I1V is an Agilex F-series System on Chip (SoC) FPGA manufactured by Altera. It integrates a Hard Processor System featuring a quad-core ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point capabilities. The device provides 2.7 million logic elements and includes 256KB of RAM. Operating at speeds up to 1.4GHz, it supports interfaces including Ethernet, I2C, SPI, UART/USART, USB OTG, MMC/SD/SDIO, and EBI/EMI. The component is housed in a 2340-ball BGA package measuring 45x45mm, with an operating temperature range of -40°C to 100°C TJ.

Soc System On Chip Feature Summary

  • Integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point units for embedded processing tasks.
  • Provides high-density programmable logic resources suitable for complex digital design implementations.
  • Supports diverse peripheral connectivity through integrated hard IP blocks for standard communication protocols.

Soc System On Chip Applications

  • Industrial automation controllers requiring combined processing and logic control
  • Telecommunications infrastructure equipment utilizing high-speed serial interfaces
  • Medical imaging systems demanding precise signal processing and data handling

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package dimensions and thermal characteristics. Ensure compatibility with existing board layouts regarding ball count and pin assignments. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly to prevent component damage during manufacturing processes.

Soc System On Chip Selection Notes

Select this model when both substantial logic capacity and embedded ARM processing are required within a single device. Compare I/O counts and memory sizes against alternative Agilex F-series variants to ensure optimal resource utilization. Evaluate thermal management requirements based on the specified junction temperature range and power consumption estimates.

Soc System On Chip Part Context

This component belongs to the Agilex F-series family, which combines FPGA fabric with hardened ARM processors. It succeeds previous generations by offering improved performance per watt and enhanced security features. The series targets applications needing flexible logic alongside deterministic real-time processing capabilities.

Soc System On Chip Replacement Considerations

Direct substitutes include other Agilex F-series devices with similar logic densities and package footprints. Verify pin-to-pin compatibility before replacing components to avoid redesign efforts. Consult official migration guides for architectural differences between generation families.

AGFB027R31C2I1VAGFB027R31C2I1V
$35,682.39
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