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AGFB027R31C3I3V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 3184FBGA. Review the specifications below when checking this part for your BOM.
The AGFB027R31C3I3V is a System-on-Chip FPGA belonging to the Agilex 7 F-Series, manufactured by Altera. It integrates 2.7 million logic elements within a 3184-pin FBGA package measuring 56x45 mm. The device features a quad-core ARM Cortex-A53 processor running at 1.4 GHz with CoreSight technology and NEON support. It includes 256 KB of embedded RAM and supports 720 I/O pins. Connectivity options encompass Ethernet, USB OTG, SPI, UART, and MMC/SD interfaces. Operating temperatures range from 0°C to 100°C TJ.
Verify the specific suffix C3 against official datasheets to confirm performance grade and temperature rating. Confirm RoHS compliance status through manufacturer documentation prior to ordering. Ensure ESD handling protocols are followed due to moisture sensitivity classification. Validate pinout compatibility with existing board designs using official package drawings.
Select this model when both high-performance ARM processing and substantial FPGA fabric are required in a single component. Compare logic density and processor speed against alternative Agilex series devices to match application complexity. Evaluate thermal management requirements based on the 100°C junction temperature limit and power consumption characteristics.
This component belongs to the Agilex 7 family, representing a generation of hybrid SoC FPGAs combining ARM processors with programmable logic. It succeeds earlier Agilex generations and serves as a foundational platform for advanced embedded systems requiring heterogeneous computing capabilities within a compact form factor.
Direct substitutes include other Agilex 7 F-Series variants such as AGFA027R31C2I3V or AGIB027R31A2E3V. Verify functional equivalence regarding processor cores, logic capacity, and I/O counts before substitution. Package dimensions must remain compatible with existing PCB footprints during replacement planning.
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