Soc System On Chip AGFC019R24C3E3E product image

AGFC019R24C3E3E

$12,419.43
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:a02c7c93adb6 Category: Brand:

  
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AGFC019R24C3E3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFC019R24C3E3E

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

Soc System On Chip datasheet and documents for AGFC019R24C3E3E

AGFC019R24C3E3E

Soc System On Chip Overview

The Altera AGFC019R24C3E3E is a Field Programmable Gate Array (FPGA) belonging to the Agilex 7 F-Series, specifically within the AGF019 device family. It features approximately 1.9 million logic elements for high-density programmable logic applications. The component utilizes a 3184-ball Ball Grid Array (BGA) package with dimensions of 56mm by 45mm. Designed for industrial reliability, it operates within a junction temperature range of 0°C to 100°C. The device supports moisture sensitivity levels requiring specific handling protocols during assembly and storage.

Soc System On Chip Feature Summary

  • Integrates high-capacity programmable logic fabric suitable for complex digital system implementations.
  • Utilizes a compact BGA form factor optimized for dense board layouts and thermal management.
  • Complies with industrial temperature standards for robust operation in demanding environments.

Soc System On Chip Applications

  • High-performance data center acceleration and networking infrastructure
  • Industrial automation and control systems requiring reliable programmable logic
  • Test and measurement equipment utilizing advanced signal processing

Soc System On Chip Procurement Notes

Verify the exact suffix configuration against official datasheets to ensure compatibility with required speed grades and environmental ratings. Confirm availability status through authorized distributors as supply conditions may vary. Request updated RoHS compliance documentation and moisture sensitivity level details prior to ordering to align with manufacturing floor requirements.

Soc System On Chip Selection Notes

Compare the 1.9M LE capacity against project logic requirements to ensure sufficient resources. Evaluate the 3184-BGA package constraints regarding PCB footprint and thermal dissipation capabilities. Consider the operating temperature range relative to the final application environment. Review pinout assignments for interface compatibility with existing system architectures.

Soc System On Chip Part Context

This component is part of the Agilex 7 F-Series portfolio, designed to balance performance and power efficiency. The AGF019 designation indicates its position within the series logic density hierarchy. It shares architectural similarities with other Agilex devices but offers specific I/O and logic configurations tailored for mid-to-high volume deployments.

Soc System On Chip Replacement Considerations

Direct substitutes are not publicly confirmed for this specific suffix combination. Alternative Agilex 7 models with similar logic densities should be evaluated for pin-to-pin or functional compatibility. Consult official cross-reference guides for potential upgrades within the same family.

AGFC019R24C3E3EAGFC019R24C3E3E
$12,419.43
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