AGFC019R24C3E3V

Soc System On Chip Overview

The Altera AGFC019R24C3E3V is a System on Chip (SoC) FPGA belonging to the Agilex 7 F-Series, specifically the AGF019 device family. It integrates programmable logic with embedded processing cores, featuring ARM Cortex-A53 processors and NEON multimedia extensions. The component utilizes a 3184-ball Ball Grid Array (BGA) package with dimensions of 56x45 mm. Designed for high-performance applications, it supports advanced interface protocols and operates within a specified temperature range.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-A53 MPCore processors with CoreSight debug infrastructure
• Supports high-speed serial interfaces including Ethernet and USB OTG
• Includes dedicated DMA controllers and watchdog timers for system management

Soc System On Chip Applications

• Industrial automation control systems
• Telecommunications baseband processing
• Medical imaging equipment signal processing

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to ensure compatibility with required speed grades and package variants. Confirm RoHS compliance status and moisture sensitivity level requirements prior to integration into the manufacturing process.

Soc System On Chip Selection Notes

Evaluate the available logic element count and embedded memory resources against the target design complexity. Ensure the selected package size accommodates the necessary I/O pin count and thermal dissipation requirements for the intended operating environment.

Soc System On Chip Part Context

This component is part of the Agilex 7 portfolio, representing a significant advancement in FPGA technology by combining high-density programmable logic with powerful embedded processor subsystems. It targets applications requiring both hardware flexibility and software-defined processing capabilities.

Soc System On Chip Replacement Considerations

Direct replacements are limited within the same Agilex 7 F-Series family. Consider devices with similar logic density and package footprint, ensuring pin-to-pin compatibility if board re-spin is not feasible.