AGFC019R25A2E3E

$14,701.65

Description：IC FPGA AGILEX-F 2581FBGA
Series：Agilex F

SKU:885359b8cbdb Category: System On Chip (SoC) Brand: Altera

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Product introduction

AGFC019R25A2E3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2581FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFC019R25A2E3E

Description：IC FPGA AGILEX-F 2581FBGA
Series：Agilex F
Mfr：Altera
Package：Tray
Architecture：MPU, FPGA
Core Processor：Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
Flash Size：-
RAM Size：256KB
Peripherals：DMA, WDT
Connectivity：EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed：1.4GHz
Primary Attributes：FPGA - 1.9M Logic Elements
Operating Temperature：0°C ~ 100°C (TJ)
Package / Case：-
Supplier Device Package：-

Soc System On Chip datasheet and documents for AGFC019R25A2E3E

AGFC019R25A2E3E

Soc System On Chip Overview

The AGFC019R25A2E3E is an FPGA from the Agilex 7 F-Series, manufactured by Altera. It features a logic element count of 1,918,000 LEs and utilizes a Tray package. The device is classified under Programmable Logic ICs within the Agilex family.

Soc System On Chip Applications

High-performance computing systems
Data center infrastructure acceleration
Advanced networking equipment

Soc System On Chip Procurement Notes

Verify the specific suffix E3E against official Intel/Altera documentation to confirm pinout and electrical characteristics. Confirm availability status with authorized distributors as supply may be restricted.

Soc System On Chip Selection Notes

Select this model for applications requiring high-density logic within the Agilex 7 architecture. Ensure design compatibility with the R25A package and verify thermal requirements for the Tray form factor.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F-Series, which focuses on high-performance logic density. It builds upon previous generations to offer improved efficiency and capacity for complex digital designs.