AGFC023R24C2E4X

Soc System On Chip Overview

The AGFC023R24C2E4X is an FPGA SoC from the Altera Agilex 7 F-Series, specifically within the AGF023 device family. It utilizes a 2340-ball FBGA package for surface-mount installation and exhibits moisture sensitivity. The component integrates programmable logic fabric with embedded processing capabilities, functioning as a System on Chip. Official documentation identifies it under the Agilex trademark and categorizes it within SOC systems. The part is subject to specific environmental compliance standards and requires careful handling due to its sensitivity characteristics during storage and assembly processes.

Soc System On Chip Feature Summary

• Integrates FPGA fabric with hard processor system (HPS) capabilities for SoC functionality
• Utilizes high-density FBGA packaging for advanced board integration
• Part of the Agilex 7 F-Series architecture designed for complex system-on-chip applications

Soc System On Chip Applications

• High-performance computing systems requiring integrated processing and logic
• Advanced telecommunications infrastructure equipment
• Industrial automation controllers with mixed-signal requirements

Soc System On Chip Procurement Notes

Verify availability status directly with authorized distributors or the manufacturer, as supply constraints may apply. Confirm RoHS compliance details and moisture sensitivity level (MSL) ratings prior to procurement. Ensure that the ordering suffix matches the required package and temperature specifications exactly. Request official datasheets and customer advisories to validate current production status and any potential obsolescence notices before finalizing purchase orders.

Soc System On Chip Selection Notes

Select this component when a high-density FPGA SoC solution is required within the Agilex 7 ecosystem. Evaluate the AGF023 series capacity against design logic resource needs. Consider the 2340-ball FBGA package dimensions for PCB layout constraints. Verify compatibility with Agilex 7 design tools and IP cores. Assess thermal management requirements associated with the specific package type and intended operating conditions.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series, representing Altera's advanced FPGA technology node. The AGF023 designation indicates a specific density tier within the family. It shares architectural similarities with other Agilex 7 devices but offers distinct I/O and logic resources. The R24C package code defines the physical footprint and pinout configuration essential for board design compatibility.

Soc System On Chip Replacement Considerations

Direct substitutes are not explicitly listed in available public data. Equivalent parts must be sought within the same Agilex 7 F-Series family with matching logic density and package options. Consult official cross-reference guides or distributor substitution tools for verified alternatives.