AGFC023R24C2I2V

Soc System On Chip Overview

The AGFC023R24C2I2V is an FPGA from the Intel Agilex 7 F-Series, specifically within the AGF023 device family. It is manufactured using 10nm SuperFin process technology and contains 2,308,000 logic elements. The component is housed in a tray package and is classified under Programmable Logic ICs. It features moisture sensitivity and carries the Altera trademark.

Soc System On Chip Feature Summary

• Built on 10nm SuperFin process technology for high-density logic implementation
• Part of the Agilex 7 F-Series designed for general-purpose applications
• Includes advanced digital signal processing modules supporting multiple precision formats

Soc System On Chip Applications

• General-purpose programmable logic systems
• High-performance digital signal processing implementations
• System integration requiring flexible logic resources

Soc System On Chip Procurement Notes

Verify the specific suffix 'I2V' against official Intel documentation to confirm temperature range and speed grade. Confirm availability status as distribution channels may indicate restricted supply or limited regional sales. Ensure the source provides original manufacturer labeling for authenticity verification.

Soc System On Chip Selection Notes

Select this model when 2.3 million logic elements are required within the Agilex 7 architecture. Compare with other AGF023 variants based on necessary speed grades and operating temperature specifications. Consider the 10nm node benefits for power efficiency relative to previous generation Stratix devices.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series, which utilizes 10nm SuperFin technology. It offers significant performance improvements over prior generations while reducing total power consumption. The series supports high-speed transceivers and advanced DSP capabilities for complex system designs.

Soc System On Chip Replacement Considerations

Direct substitutes include other AGFC023 variants such as AGFC023R25A2E1V or AGFC023R31C2I2V. Verify that alternative parts match the required logic density and package type. Check if different speed grades or temperature ranges meet the specific design constraints.