Soc System On Chip AGFC023R24C3I3E product image

AGFC023R24C3I3E

$17,454.03
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:0bb9aaa7a266 Category: Brand:

  
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AGFC023R24C3I3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFC023R24C3I3E

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

Soc System On Chip datasheet and documents for AGFC023R24C3I3E

AGFC023R24C3I3E

Soc System On Chip Overview

The AGFC023R24C3I3E is an FPGA from the Altera Agilex 7 F-Series, specifically within the AGF022/AGF023 device family. It features a logic capacity of 2,308,000 Logic Elements (LEs) and utilizes a Tray packaging format. The component is classified under Programmable Logic ICs and carries the Altera trademark. It is designated as moisture-sensitive and supports SMD/SMT installation styles. This part number represents a specific configuration within the broader Agilex 7 portfolio designed for high-performance programmable logic applications.

Soc System On Chip Feature Summary

  • Supports advanced programmable logic architecture within the Agilex 7 F-Series family
  • Designed for system integration with tailored packaging options
  • Compatible with Quartus Prime design software and third-party EDA tools

Soc System On Chip Applications

  • 6G AI RAN systems
  • O-RAN Radio Unit (RU) Macro & Micro implementations
  • vRAN and Fronthaul infrastructure

Soc System On Chip Procurement Notes

Verify availability status directly with authorized distributors or the manufacturer, as supply constraints may apply to this specific Agilex 7 variant. Confirm that the ordering suffix matches the required package and temperature grade. Ensure compliance with RoHS directives and handle the component according to moisture sensitivity level (MSL) guidelines during storage and assembly processes.

Soc System On Chip Selection Notes

Select this model when a logic density of approximately 2.3 million LEs is required within the Agilex 7 ecosystem. Compare against other AGF023 variants if different pin counts or I/O configurations are needed. Ensure the design flow supports the specific R24C package type and verify compatibility with required IP cores such as Ethernet or PCIe before finalizing the component choice.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F-Series, which targets high-end data center and communication applications. The AGF023 designation indicates a specific tier within the family, offering substantial logic resources. It shares design methodologies and toolchains with other Agilex devices, allowing for scalable development across the product line while maintaining architectural consistency for complex system-on-chip designs.

Soc System On Chip Replacement Considerations

Direct substitutes include other Agilex 7 F-Series parts with equivalent logic densities, such as AGFC023R24C2E3V or AGFD023R24C2E3E, depending on whether SoC capabilities are required. Verify pin-to-pin compatibility and electrical specifications before substitution. Cross-reference with the official Agilex 7 selection guide to ensure functional equivalence in terms of I/O standards and transceiver capabilities.

AGFC023R24C3I3EAGFC023R24C3I3E
$17,454.03
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