AGFC023R25A1E1V

Soc System On Chip Overview

The AGFC023R25A1E1V is an FPGA from the Intel Agilex 7 F-Series, specifically within the AGF023 device family. It features a logic capacity of 2,308,000 Logic Elements (LEs) and utilizes a 25mm x 25mm package footprint designated as R25. The component is housed in an FBGA-2581 package configuration. This device supports high-density programmable logic applications requiring significant fabric resources without embedded memory blocks.

Soc System On Chip Feature Summary

• High-density programmable logic fabric with over two million logic elements
• Agilex 7 F-Series architecture for advanced system integration
• FBGA-2581 surface-mount package for board-level compatibility

Soc System On Chip Applications

• High-performance data center acceleration
• Telecommunications infrastructure processing
• Industrial automation control systems

Soc System On Chip Procurement Notes

Verify the specific suffix A1 against official Intel documentation to confirm manufacturing date code or revision level. Confirm availability status through authorized distributors as supply may be restricted. Ensure ESD handling protocols are followed during procurement and storage due to moisture sensitivity classification.

Soc System On Chip Selection Notes

Select this model when a large logic resource count is required within the Agilex 7 F-Series form factor. Compare against AGFC023R25A2 variants if higher speed grades are needed. Ensure the design accommodates the thermal requirements associated with the FBGA-2581 package density.

Soc System On Chip Part Context

This part belongs to the Intel Agilex 7 family, representing a generation of FPGAs designed for high-bandwidth and low-latency applications. The AGF023 series offers a balance of logic density and power efficiency compared to previous Stratix generations, targeting modern compute-intensive workloads.