AGFC023R25A2E4X

Soc System On Chip Overview

The AGFC023R25A2E4X is a System on Chip FPGA belonging to the Intel Agilex 7 F-Series. It integrates an ARM Cortex-A53 processor with FPGA fabric, featuring 2.3 million logic elements and 1.4 GHz processor speed. The device utilizes a 3184-ball FBGA package (56x45 mm) with bare pads. Key specifications include 480 I/Os, 256 KB of embedded RAM, and support for peripherals such as DMA and WDT. Operating temperatures range from 0°C to 100°C TJ.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight technology
• Combines high-density FPGA fabric with embedded processing capabilities
• Supports diverse connectivity interfaces including Ethernet, USB OTG, and SPI

Soc System On Chip Applications

• High-performance edge computing systems
• Industrial automation controllers
• Network infrastructure equipment

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official Intel documentation to confirm package type and temperature grade. Confirm availability status through authorized distributors as supply may be restricted. Ensure compatibility with required design tools and IP libraries before procurement.

Soc System On Chip Selection Notes

Select this model when requiring integrated ARM processing alongside substantial FPGA resources. Compare logic element counts and I/O density against alternative Agilex series devices. Validate power consumption requirements against the specific operating conditions and thermal constraints of the target application environment.

Soc System On Chip Part Context

This component is part of the Agilex 7 family, succeeding previous generations like Cyclone and Stratix. It represents a shift toward heterogeneous computing by combining programmable logic with hardened ARM processors. The F-Series targets applications needing both high performance and energy efficiency.

Soc System On Chip Replacement Considerations

Check for direct pin-compatible alternatives within the same Agilex 7 F-Series lineup. Verify if higher or lower density variants offer necessary resource adjustments without redesigning the PCB layout.