AGFC023R31C2E3V

Soc System On Chip Overview

The AGFC023R31C2E3V is an Agilex 7 F-Series Field Programmable Gate Array manufactured by Altera. It features a logic capacity of 2,308,000 logic elements and utilizes a 3184-BFBGA package with dimensions of 56x45 mm. The device operates within a junction temperature range of 0°C to 100°C. It is classified under programmable logic ICs and supports humidity-sensitive handling protocols.

Soc System On Chip Feature Summary

• Integrates high-density programmable logic fabric for complex digital system implementation
• Utilizes advanced BFBGA packaging for robust board-level interconnectivity
• Designed for integration into systems requiring significant programmable resource density

Soc System On Chip Applications

• High-performance embedded logic processing
• Industrial control system prototyping
• Telecommunications infrastructure signal processing

Soc System On Chip Procurement Notes

Verify the specific suffix E3V against official Altera documentation to confirm exact manufacturing lot attributes and compliance certifications. Confirm availability status through authorized distributors as supply may be restricted in certain regions. Ensure proper electrostatic discharge precautions are observed during handling due to moisture sensitivity classification.

Soc System On Chip Selection Notes

Select this component when a logic count near 2.3 million elements is required within the Agilex 7 family. Compare pinout compatibility and thermal characteristics against alternative packages in the same series. Validate that the 3184-ball footprint aligns with existing PCB design constraints and manufacturing capabilities.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series, which targets cost-sensitive applications compared to higher-end Stratix devices. The R31 designation indicates specific silicon revision and performance binning within the AGF023 logical capacity tier. It serves as a scalable solution for mid-range FPGA requirements.

Soc System On Chip Replacement Considerations

Direct substitutes include other Agilex 7 F-Series parts with identical or compatible logic densities such as AGFC023R31 variants. Verify pin-to-pin compatibility before substitution. Cross-reference with AGFA series if SoC capabilities are not required.