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AGFD019R24C2I3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340BGA. Review the specifications below when checking this part for your BOM.
The AGFD019R24C2I3E is a System on Chip FPGA belonging to the Agilex 7 F-Series, specifically the AGF019 device variant. Manufactured by Altera, this component integrates programmable logic with embedded processing capabilities within a single package. It utilizes an FBGA-2340 surface-mount package design suitable for high-density board layouts. The device supports SMD/SMT installation methods and is classified under humidity-sensitive categories requiring appropriate handling protocols during manufacturing processes.
Verify component authenticity through authorized distribution channels only. Confirm RoHS compliance status via official datasheets prior to integration. Ensure proper moisture barrier packaging is maintained until soldering to prevent damage due to humidity sensitivity. Validate that the specific suffix matches project requirements as ordering variations may exist without functional changes.
Select this model when Agilex 7 F-Series performance levels are required. Consider the FBGA-2340 footprint constraints during PCB layout planning. Evaluate thermal management solutions suitable for the specific operating environment. Compare against other AGF019 variants if different package options or speed grades better suit the design constraints.
This component belongs to the broader Agilex 7 FPGA portfolio developed by Altera. It shares architectural similarities with other devices in the AGF019 series while offering specific pinout and feature configurations unique to the R24C package code. The Agilex 7 platform represents a significant generation shift in programmable logic technology from previous families.
Direct substitutes include other Agilex 7 F-Series devices such as AGFB019R24C3E4X or AGFD019R24C2E4X. Verify pin compatibility and electrical specifications before substitution. Different suffixes may indicate variations in temperature range or packaging rather than core functionality.
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