Soc System On Chip AGFD019R25A2E2V product image

AGFD019R25A2E2V

$14,717.76
  • Description:IC FPGA AGILEX-F 2581FBGA
  • Series:Agilex F

SKU:fd8cdc9f740c Category: Brand:

  
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AGFD019R25A2E2V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2581FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFD019R25A2E2V

  • Description:IC FPGA AGILEX-F 2581FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:-
  • Supplier Device Package:-

Soc System On Chip datasheet and documents for AGFD019R25A2E2V

AGFD019R25A2E2V

Soc System On Chip Overview

The Altera AGFD019R25A2E2V is a System-on-Chip Field-Programmable Gate Array belonging to the Agilex 7 F-Series. It integrates an ARM-based Hard Processor System with high-density FPGA fabric, supporting advanced memory interfaces including DDR5 and LPDDR5. The device utilizes a 2340-pin FBGA package and is designed for applications requiring significant computational throughput and deterministic performance in physical AI systems.

Soc System On Chip Feature Summary

  • Integrates ARM-based Hard Processor System with FPGA fabric
  • Supports next-generation DDR5 and LPDDR5 memory technologies
  • Optimized for spatial architecture mapping of AI algorithms

Soc System On Chip Applications

  • High-performance RF systems
  • Physical AI system implementations
  • Edge computing acceleration

Soc System On Chip Procurement Notes

Verify current availability status as supply may be restricted. Confirm RoHS compliance details through official documentation. Ensure handling procedures account for moisture sensitivity classification during storage and assembly processes.

Soc System On Chip Selection Notes

Evaluate logic element requirements against the 1.9 million LE capacity. Assess compatibility with existing PCB layouts for the 2340-pin FBGA footprint. Consider thermal management solutions suitable for high-density SoC FPGA power profiles.

Soc System On Chip Part Context

This component is part of the Agilex 7 family, extending lifecycle support through 2045. It represents a transition from previous generations by offering higher compute density and integrated processing capabilities within a single silicon solution.

Soc System On Chip Replacement Considerations

Cross-reference with other Agilex 7 variants such as AGFC019R25A2E2V or AGFA019R25A2E4X for pin-compatible alternatives. Verify functional equivalence regarding processor integration and memory interface support before substitution.

AGFD019R25A2E2VAGFD019R25A2E2V
$14,717.76
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