AGFD019R25A3I3E

Soc System On Chip Overview

The AGFD019R25A3I3E is a System-on-Chip FPGA belonging to the Intel Agilex 7 F-Series, specifically the AGF019 device family. It integrates an Arm-based Hard Processor System (HPS) with high-density FPGA fabric on a single die. The component utilizes a 2340-ball FBGA package for surface-mount installation. As an SoC FPGA, it combines programmable logic resources with embedded processing capabilities, memory interfaces, and peripheral controllers, designed for complex system integration requiring both hardware acceleration and software control within a unified architecture.

Soc System On Chip Feature Summary

• Integrates an Arm-based Hard Processor System alongside FPGA fabric
• Supports high-speed transceiver interfaces for data communication
• Provides embedded memory blocks for data storage and processing

Soc System On Chip Applications

• High-performance computing infrastructure
• Telecommunications baseband processing
• Industrial automation systems

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official Intel documentation to confirm temperature range and package variant. Ensure compatibility with required power delivery specifications and thermal management solutions during design validation. Confirm RoHS compliance status through current manufacturer declarations prior to procurement.

Soc System On Chip Selection Notes

Select this model when a combined processor and programmable logic solution is required. Evaluate the AGF019 resource density against application logic requirements. Consider the FBGA-2340 package constraints for PCB layout and ensure support for the necessary I/O standards and transceiver speeds available in the F-Series.

Soc System On Chip Part Context

This component is part of the Intel Agilex 7 portfolio, representing a transition from traditional Altera branding to Intel's semiconductor division. The Agilex 7 series introduces new architectural features compared to previous generations like Arria 10 or Stratix 10, focusing on improved performance per watt and advanced packaging technologies for next-generation data center and edge applications.

Soc System On Chip Replacement Considerations

Direct pin-to-pin replacements are not publicly documented for this specific Agilex 7 configuration. Cross-referencing may involve other Agilex 7 F-Series devices with similar logic densities or package footprints, subject to functional compatibility verification.