Soc System On Chip AGFD019R31C3I3E product image

AGFD019R31C3I3E

$17,219.35
  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F

SKU:a5fe2d07d8ad Category: Brand:

  
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AGFD019R31C3I3E is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 3184FBGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFD019R31C3I3E

  • Description:IC FPGA AGILEX-F 3184FBGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 1.9M Logic Elements
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:3184-BFBGA Exposed Pad
  • Supplier Device Package:3184-BGA (56x45)

Soc System On Chip datasheet and documents for AGFD019R31C3I3E

AGFD019R31C3I3E

Soc System On Chip Overview

The AGFD019R31C3I3E is an Agilex F-series System-on-Chip FPGA manufactured by Altera. It integrates a quad-core ARM Cortex-A53 processor with NEON and floating-point units, operating at speeds up to 1.4 GHz. The device features approximately 1.9 million logic elements and includes 256 KB of embedded RAM. It utilizes a 3184-ball BGA package measuring 56x45 mm, supporting up to 480 I/Os. Connectivity options include Ethernet, USB OTG, SPI, UART, and MMC/SD interfaces. The component operates within a junction temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

  • Integrates a quad-core ARM Cortex-A53 MPCore processor with CoreSight debug capabilities
  • Combines high-density programmable logic with embedded processing subsystems
  • Supports diverse peripheral interfaces including Ethernet, USB OTG, and serial protocols

Soc System On Chip Applications

  • High-performance embedded computing systems requiring mixed logic and processing
  • Industrial automation controllers with real-time processing needs
  • Network infrastructure equipment utilizing integrated Ethernet connectivity

Soc System On Chip Procurement Notes

Verify the specific suffix codes against official datasheets to confirm package dimensions and thermal characteristics. Ensure compatibility with existing board layouts regarding the 3184-BGA footprint. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly to prevent damage during manufacturing processes.

Soc System On Chip Selection Notes

Select this model when both substantial logic capacity and embedded ARM processing are required in a single component. Compare pin counts and I/O voltage requirements against system interface specifications. Evaluate thermal management solutions suitable for the specified junction temperature range and power consumption levels under load.

Soc System On Chip Part Context

This component belongs to the Agilex F series, designed for applications demanding high performance and low power consumption. It represents a convergence of FPGA flexibility and processor efficiency, targeting complex embedded designs that require rapid prototyping and field-upgradable logic alongside stable software execution environments.

Soc System On Chip Replacement Considerations

Direct substitutes within the same family include AGFA019R31C3E3E and AGFA019R31C3E4X. Verify pinout compatibility and functional equivalence before swapping components to ensure system integrity.

AGFD019R31C3I3EAGFD019R31C3I3E
$17,219.35
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