AGFD023R24C2E2V

Soc System On Chip Overview

The AGFD023R24C2E2V is an FPGA SoC belonging to the Agilex 7 F-Series, manufactured by Altera. It utilizes a 2340-pin FBGA package designed for surface-mount installation. The component supports high-density system integration with moisture sensitivity classification requiring specific handling protocols. As part of the Agilex portfolio, it integrates programmable logic with embedded processing capabilities.

Soc System On Chip Feature Summary

• Integrates spatial architecture for scalable compute and connectivity
• Supports high-speed transceiver interfaces for data center applications
• Includes embedded hard processor systems for mixed-signal processing

Soc System On Chip Applications

• Data center infrastructure acceleration
• Wireless baseband processing
• Industrial automation control systems

Soc System On Chip Procurement Notes

Verify RoHS compliance status through official manufacturer documentation before procurement. Confirm availability as distribution channels may indicate regional sales restrictions. Ensure proper ESD protection during storage and handling due to moisture sensitivity classification requirements specified in the datasheet.

Soc System On Chip Selection Notes

Select this model for designs requiring high I/O density within the Agilex 7 family. Evaluate pin compatibility with the 2340-pin FBGA footprint during PCB layout. Consider thermal management solutions suitable for high-performance FPGA SoC operation under varying environmental conditions.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F-Series (AGF), representing Altera's advanced programmable logic technology. The series targets high-performance computing markets with extended product longevity support through 2045. It complements the broader Agilex portfolio including M-Series and I-Series variants.

Soc System On Chip Replacement Considerations

Consult official substitution guides for compatible Agilex 7 devices. Verify pin-to-pin compatibility and functional equivalence before replacing existing designs. Review technical advisories for any known issues affecting similar package configurations.