Soc System On Chip AGFD023R24C3E3V product image

AGFD023R24C3E3V

$11,645.01
  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F

SKU:ec99757744c7 Category: Brand:

  
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AGFD023R24C3E3V is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2340BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for AGFD023R24C3E3V

  • Description:IC FPGA AGILEX-F 2340BGA
  • Series:Agilex F
  • Mfr:Altera
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Speed:1.4GHz
  • Primary Attributes:FPGA - 2.3M Logic Elements
  • Operating Temperature:0°C ~ 100°C (TJ)
  • Package / Case:2340-BFBGA Exposed Pad
  • Supplier Device Package:2340-BGA (45x42)

Soc System On Chip datasheet and documents for AGFD023R24C3E3V

AGFD023R24C3E3V

Soc System On Chip Overview

The AGFD023R24C3E3V is an FPGA SoC belonging to the Agilex 7 F-Series, specifically within the AGF023 device family. It utilizes a 2340-ball FBGA package and supports surface-mount installation. The component integrates programmable logic with embedded processor systems, functioning as a System on Chip. Official documentation confirms its classification under SOC - Systems on a Chip subcategory. The device exhibits moisture sensitivity and requires specific handling protocols during assembly. It is part of the broader Altera Agilex portfolio designed for high-performance computing applications.

Soc System On Chip Feature Summary

  • Integrates field-programmable gate array logic with embedded processor cores for system-on-chip functionality
  • Utilizes the Agilex 7 architecture for advanced signal processing and connectivity
  • Supports high-density interconnect requirements through a large ball grid array package

Soc System On Chip Applications

  • High-performance computing infrastructure
  • Advanced networking equipment requiring integrated processing
  • Industrial automation systems with complex control logic

Soc System On Chip Procurement Notes

Verify the exact suffix configuration against official Intel/Altera datasheets before procurement, as minor alphanumeric differences can indicate distinct packaging or temperature grades. Confirm availability status directly with authorized distributors, as supply constraints may affect delivery timelines. Ensure compliance with RoHS directives and moisture sensitivity level requirements during storage and handling procedures.

Soc System On Chip Selection Notes

Select this model when a combination of high-end FPGA fabric and embedded processor capabilities is required within the Agilex 7 ecosystem. Consider the 2340-ball FBGA footprint for PCB layout compatibility. Evaluate thermal management solutions suitable for high-density SoC packages. Compare against other AGF023 variants if specific I/O counts or memory interfaces differ from project requirements.

Soc System On Chip Part Context

This component belongs to the Agilex 7 F-Series, a line of high-performance FPGAs and SoCs from Altera (now Intel). The AGF023 designation indicates a specific density tier within the family. These devices are engineered for demanding applications in data centers, telecommunications, and enterprise infrastructure, offering scalable performance and energy efficiency compared to previous generation architectures.

Soc System On Chip Replacement Considerations

Direct substitutes within the same package and pinout include other AGFD023R24C3E3V units or compatible AGF023 series variants with identical electrical characteristics. Cross-family replacements require careful verification of pin compatibility and software support via Quartus Prime software.

AGFD023R24C3E3VAGFD023R24C3E3V
$11,645.01
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