AGFD023R24C3I3E

Soc System On Chip Overview

The AGFD023R24C3I3E is an FPGA SoC belonging to the Agilex 7 F-Series, specifically within the AGF023 device family. It utilizes a 2340-ball FBGA package designed for surface-mount technology applications. The component integrates programmable logic with embedded processing capabilities on a single chip. Official documentation identifies it as part of the Agilex trademark line manufactured by Altera. The device exhibits moisture sensitivity and requires specific handling protocols during assembly. This model represents a high-density solution intended for complex system-on-chip implementations requiring significant logic resources.

Soc System On Chip Feature Summary

• Integrates Field-Programmable Gate Array logic with System-on-Chip processing elements
• Utilizes a high-pin-count Ball Grid Array package for dense board integration
• Designed for surface-mount installation techniques
• Part of the Agilex 7 F-Series product family

Soc System On Chip Applications

• High-performance computing systems
• Telecommunications infrastructure equipment
• Industrial automation controllers

Soc System On Chip Procurement Notes

Verify the exact suffix configuration against official manufacturer datasheets before procurement. Suffix variations often indicate differences in temperature grades, packaging types, or compliance standards. Confirm availability status directly with authorized distributors as supply constraints may apply. Ensure all ordering specifications match the required technical parameters for your specific design implementation.

Soc System On Chip Selection Notes

Select this component based on the required logic density and I/O count provided by the AGF023 family tier. Evaluate the 2340-ball FBGA package dimensions against your printed circuit board layout constraints. Consider thermal management requirements associated with high-density FPGA SoC devices. Verify that your design tools support the specific Agilex 7 architecture features available in this series.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F-Series, which offers scalable performance for demanding applications. The AGF023 designation indicates a specific tier within the family regarding logic capacity. Altera manufactures this series to provide advanced connectivity and processing capabilities. The R24C package code corresponds to the physical footprint and pin arrangement defined in the official package drawings.

Soc System On Chip Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material. Consult official manufacturer cross-reference guides for compatible alternatives. Ensure any replacement maintains identical package dimensions and pin compatibility.