AGFD023R25A2I3V

Soc System On Chip Overview

The AGFD023R25A2I3V is an Agilex 7 FPGA from Altera, designed for high-performance applications. It features a logic capacity of 2,308,000 logic elements and utilizes the FBGA-2581 package. The device supports surface mount technology and includes moisture sensitivity characteristics. This component belongs to the Agilex 7 F series, specifically the AGF023 variant, providing scalable programmable logic infrastructure.

Soc System On Chip Feature Summary

• Integrates over two million logic elements for complex digital design implementation within the Agilex 7 architecture.

Soc System On Chip Applications

• High-density programmable logic systems
• Agilex 7 series FPGA deployments

Soc System On Chip Procurement Notes

Verify the specific suffix I3V against official Intel/Altera documentation to confirm temperature range and package specifications. Ensure compatibility with existing board designs regarding the FBGA-2581 footprint. Confirm moisture sensitivity level requirements for manufacturing processes before procurement.

Soc System On Chip Selection Notes

Select this model when a logic density exceeding two million elements is required within the Agilex 7 family. Consider the FBGA-2581 package constraints for PCB layout. Evaluate if the standard industrial or commercial grade variants meet thermal requirements compared to other Agilex 7 options.

Soc System On Chip Part Context

This part belongs to the Agilex 7 F series, representing a high-end FPGA offering from Altera (Intel). It targets applications demanding significant programmable logic resources. The AGF023 designation indicates its position within the family's logic capacity hierarchy.

Soc System On Chip Replacement Considerations

Consult official substitution guides for Agilex 7 series equivalents. Verify pinout and logic resource compatibility with alternative models such as AGFC or AGFA variants before replacement.