AGIB019R18A2E1VB

Soc System On Chip Overview

The Altera AGIB019R18A2E1VB is a System on Chip (SoC) FPGA from the Agilex I series. It integrates a four-core ARM Cortex-A53 MPCore processor with CoreSight, ARM NEON, and floating-point units alongside an FPGA fabric containing 1.9 million logic elements. The device operates at a maximum speed of 1.4GHz and includes 256KB of RAM. It features 480 I/Os and supports interfaces including Ethernet, USB OTG, SPI, UART, I2C, MMC/SD/SDIO, EBI/EMI, and DMA/WDT peripherals. Packaged in a 1805-BBGA bare pad format measuring 42.5x42.5 mm, it functions within a junction temperature range of 0°C to 100°C.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 application processor with NEON and floating-point capabilities for embedded control tasks.
• Provides a high-density FPGA fabric with 1.9 million logic elements for customizable hardware acceleration and interconnectivity.
• Supports diverse peripheral connectivity including Ethernet, USB OTG, and standard serial protocols via dedicated controller blocks.

Soc System On Chip Applications

• Industrial automation controllers requiring deterministic real-time processing and programmable logic.
• Edge computing nodes utilizing integrated ARM cores for data preprocessing before cloud transmission.
• Telecommunications infrastructure equipment needing flexible interface adaptation and protocol handling.

Soc System On Chip Procurement Notes

Verify the specific suffix 'E1' confirms the commercial temperature grade (0°C to 100°C TJ) distinct from industrial variants. Confirm the 1805-BBGA bare pad package requires compatible substrate design for soldering. Cross-reference the latest Product Change Notifications regarding label or marking updates to ensure compliance with current manufacturing standards.

Soc System On Chip Selection Notes

Select this model when a balance of moderate FPGA capacity and robust ARM processing is required without extreme temperature tolerance. Compare against the 'I' suffix variants if operation below 0°C is necessary. Ensure the 1.9M logic element count meets design complexity while managing power consumption relative to higher-tier Agilex devices.

Soc System On Chip Part Context

This component belongs to the Agilex I family, designed for mid-range SoC applications. It shares architectural similarities with other Agilex I parts but differs in temperature rating and specific configuration options defined by its alphanumeric suffix. It serves as a bridge between standard microprocessors and high-end FPGAs.

Soc System On Chip Replacement Considerations

Direct functional substitutes include other Agilex I SoC models such as AGIB019R18A2I2V or AGIB019R18A1E2VB, provided the temperature grade and pinout compatibility are verified. Substitution requires re-evaluation of thermal management and software driver support for the specific ARM core configuration.