AGIB022R29A2E3V

Soc System On Chip Overview

The AGIB022R29A2E3V is an Agilex I System on Chip (SoC) integrated circuit manufactured by Altera. It integrates a Field Programmable Gate Array with 2.2 million logic elements and a hard processor system featuring a quad-core ARM Cortex-A53 MPCore with CoreSight, NEON, and floating-point capabilities. The device operates at a maximum frequency of 1.4 GHz and includes 256 KB of RAM. It utilizes a 3184-ball Flip-Chip Ball Grid Array (FCBGA) package with dimensions of 56x45 mm. The component supports a junction temperature range of 0°C to 100°C and offers connectivity via EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG interfaces.

Soc System On Chip Feature Summary

• Integrates a quad-core ARM Cortex-A53 processor with FPGA fabric for heterogeneous computing
• Supports high-speed peripheral interfaces including Ethernet and USB OTG
• Utilizes a large-scale FCBGA package for dense interconnectivity

Soc System On Chip Applications

• Embedded systems requiring combined processing and programmable logic
• Industrial automation controllers
• Network infrastructure equipment

Soc System On Chip Procurement Notes

Verify the specific suffix 'E3V' against official Altera documentation to confirm manufacturing lot, temperature grade, or packaging variations. Cross-reference the Mouser part number 989-AGIB022R29A2E3V and DigiKey identifier 544-AGIB022R29A2E3V-ND for availability status. Ensure compatibility with Agilex I design tools before procurement.

Soc System On Chip Selection Notes

Select this model when a balance between moderate FPGA density (2.2M LEs) and embedded ARM processing is required. Compare against the AGIB027R29A2E3V if higher logic capacity is needed, or the AGIB022R31 series for alternative pinout configurations. Confirm that the 3184-pin package fits the target board layout constraints.

Soc System On Chip Part Context

This component belongs to the Agilex I family, designed for mid-range applications within the Agilex portfolio. It shares architectural similarities with other Agilex SoCs but is distinguished by its specific 2.2M logic element count and 3184-ball package configuration. It serves as a bridge between high-performance Agilex 7 devices and lower-density Agilex 3 solutions.

Soc System On Chip Replacement Considerations

Direct substitutes include AGIB022R29A2E2VB and AGIB022R31A2E2VB within the same family. Verify pin-to-pin compatibility and electrical specifications before substitution. Consult the Agilex Migration Guide for detailed comparison of logic resources and I/O standards.